Vacuum plasma equipment

Features: high precision, fast responses, and compatibility good control, support the improvement of function and professional technology

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Vacuum plasma equipment features: high precision, fast responses, and compatibility good control, support the improvement of function and professional technology

• processing uniformity
• ion energy low, does not damage the substrate
• no electrode and substrate contamination
• patent design special plasma electrode
• high density plasma source
  § plasma with high efficiency, high cleaning efficiency
  § can control the low ion energy
  § The combination of chemical reaction and physical impact
• fast processing speed, high cleaning efficiency, high reliability
• wide operation range
• can use a variety of process gas
• Automatic and easy to operate
• equipment stability, easy maintenance
• may depend on customer demand changes

Application: applicable to the PCB industry, semiconductor IC, silica gel, plastics, polymers, automotive industry, aviation industry.
1, the PCB industry: high-frequency board surface activation, multilayer board surface cleaning, desmear, soft board, rigid Flex PCB surface cleaning, desmear, soft board reinforcing activation before.
2, IC: COB, COG semiconductor, COF, ACF process, a line marking, cleaning before welding
3, silica gel, silica gel, polymer field: plastic, plastic, polymer surface roughening, etching, activation

The specification: 1820mm (W) × 1100mm (D) × 1860mm (H)
The electrode size: 12 layers of flat type electrode plate (8500mm × 550mm)
Power supply system: 10KW plasma source (40KHz, 13.56MHz)
Control system: PC control system of +PLC automatic control
Intake system: 2 - 5 working gas optional: Ar2, N2, H2, CF4, O2

Applicable to the PCB industry, semiconductor IC, silica gel, plastics, polymers, automotive industry, aviation industry: 1, the PCB industry: high-frequency board surface activation, multilayer board surface cleaning, desmear, soft board, rigid Flex PCB surface cleaning, desmear, soft board reinforcement pre activation; 2, the semiconductor IC area: COB, COG, COF, ACF technology, used for wire, welding before cleaning; 3, silica gel, silica gel, polymer field: plastic, plastic, polymer surface roughening, etching, activation.
Vacuum plasma equipment