√With the gradual deepening of electronic technology in various application fields, the highly integrated circuit board has become an inevitable trend. The highly integrated packaging module requires a good heat dissipation and bearing system, while the disadvantage of traditional circuit boards FR-4 and CEM-3 in TC (thermal conductivity) has become a bottleneck restricting the development of electronic technology.

√The LED industry, which has developed rapidly in recent years, also puts forward higher requirements for the TC index of its bearing circuit board.

√In the field of high-power LED lighting, metal, ceramic and other materials with good heat dissipation performance are often used to prepare circuit substrate. The thermal conductivity of high thermal conductivity aluminum substrate is generally 1-4w / m.k, while the thermal conductivity of ceramic substrate can reach about 220W / m.k according to its preparation method and material formula.