When coating substrates by magnetron sputtering vacuum machine, merchants often consider whether the process meets their requirements, as well as the finished products and how to control the film uniformity. There are many products in the market that require very high film uniformity, such as electronic products, mechanical parts and other daily applications in the market, which require very high film uniformity. Therefore, many merchants pay more attention to this series of problems when purchasing magnetron sputtering machine.

The uniformity of the film deposited by magnetron sputtering vacuum coater is an important index, so it is necessary to study the influencing factors of magnetron sputtering uniformity in order to better realize magnetron sputtering uniform coating. To put it simply, magnetron sputtering means that in the orthogonal electromagnetic field, the closed magnetic field binds electrons to make spiral motion around the target surface, and in the process of motion, argon constantly collides with the working gas argon to ionize a large number of argon ions, which bombard the target under the action of the electric field, sputtering out target atomic ions (or molecules) and depositing them on the substrate to form a thin film. Therefore, in order to achieve uniform coating, it is necessary to sputter the target atomic ions (or molecules) uniformly, which requires that the argon ions bombarding the target be bombarded uniformly. Because argon ions bombard the target at an accelerated speed under the action of electric field, the electric field is required to be uniform. However, in actual magnetron sputtering equipment, some factors are difficult to be completely and absolutely uniform, so it is necessary to study the influence of their nonuniformity on the uniformity of film formation. In fact, the uniformity of magnetic field and the uniformity of working gas are the most important factors affecting the uniformity of film formation. Where the magnetic field is large, the film thickness is relatively thin, and the magnetic field direction is also an important factor affecting the uniformity. In terms of air pressure, under certain air pressure conditions, the film thickness at the position where the air pressure is high, whereas the film thickness is thin.

Everyday, we will also see the problem of uneven coating film in magnetron sputtering vacuum coating machine. Generally, when we deal with the problem, we should first try our best to ensure the uniformity and direction consistency of the magnetic field and form a relatively uniform spatial magnetic field. Then, we should try our best to ensure the uniformity of air pressure. When designing the vacuum chamber, we should consider the installation position of vacuum pump, the inlet mode of process gas and the layout of process gas pipes in the chamber. Finally, because the magnetic field and air pressure can not be absolutely ideal, the uneven magnetic field can be compensated by the uneven air pressure to make the final film uniform. Finally, the target-substrate distance is also an important factor affecting the uniformity of sputtered films.