There are many kinds of magnetron sputtering, including DC magnetron sputtering, RF magnetron sputtering, unbalanced magnetron sputtering, intermediate frequency magnetron sputtering and so on. They have different working principles and application objects, but they have one thing in common: the interaction between the magnetic field and electrons makes the electrons run spirally near the target surface, thus increasing the probability of electrons hitting argon to generate ions. The generated ions collide with the target surface under the action of the electric field, thereby sputtering the target material. The coating technology of medium frequency magnetron sputtering vacuum coating machine is widely used in daily life, so what are the differences and characteristics between it and other magnetron sputtering machines?

Thin films prepared by reactive magnetron sputtering with intermediate frequency have many excellent properties, which can't be achieved by ordinary DC magnetron sputtering or RF sputtering. The characteristics are as follows:

(1) the high quality, good uniformity of film formation and structural characteristics of the target film by reactive magnetron sputtering with intermediate frequency double targets are also due to the direct current reactive sputtering method.

(2) The deposition rate of medium-frequency reactive magnetron sputtering is high. For silicon target, the deposition rate of medium-frequency reactive sputtering is 10 times that of DC reactive sputtering and about 5 times higher than that of RF sputtering.

(3) The process of medium-frequency double-target Sanskrit magnetron sputtering can be stabilized at the set working point, which not only eliminates the phenomenon of "ignition", but also overcomes the common phenomena of target poisoning and anode disappearance in DC discharge.

(4) The manufacturing cost of the intermediate frequency power supply is lower, the installation, debugging and maintenance of equipment are easier than those of RF sputtering, the operation is stable, and the matching between the intermediate frequency power supply and the target is easier than that of RF power supply.

(5) The substrate temperature is higher, which is beneficial to improve the film quality and adhesion.

(6) The sputtering rate of reactive magnetron sputtering with medium frequency double targets is similar to that of DC sputtering. Some studies show that the deposition rate of reactive sputtering obtained by this method can reach 60%~70% of that of metal sputtering. However, RF sputtering is usually an order of magnitude lower than DC sputtering.

The coating technology of medium frequency magnetron sputtering vacuum coater double target reactive magnetron sputtering has been applied in industrial production due to its high deposition rate and good working stability, and has received increasing attention.