The reactive sputtering technology of vacuum coating machine, as the name implies, is that one substance reacts with another substance, and then sputtering. The films formed on the substrate are collectively called compound films. In the vacuum coating industry, reactive magnetron sputtering is generally It is the reaction between the target element and the gas (oxygen, nitrogen, etc.) charged into the cavity, and then sputtering to form the compound film required by the market. What are the characteristics of reactive sputtering?

      1. The target material (single-element target or multi-element target) and reactive gas (oxygen, nitrogen, hydrocarbon, etc.) used in reactive magnetron sputtering are of high purity, which is conducive to the preparation of high-purity compound films.
      2. By adjusting the process parameters in reactive magnetron sputtering, stoichiometric or non-stoichiometric compound films can be prepared, and the film properties can be controlled by adjusting the composition of the film.
      3. During the reactive magnetron sputtering deposition process, the temperature of the substrate is relatively small, and the substrate is usually not required to be heated at a high temperature during the film forming process, so there are fewer restrictions on the substrate material.
      Four: Reactive magnetron sputtering is suitable for the preparation of large-area uniform thin films, and can realize the industrialized production of a single machine with an annual output of millions of square meters of coating.
      Five: hysteresis is easy to occur. The hysteresis phenomenon makes compounds with certain chemical dose ratios unable to be obtained by reactive sputtering, and the compounds generated by the reaction between the reaction gas and the target cover the surface of the target, and accumulate a large amount of positive charges that cannot be neutralized. A higher and higher positive potential is established on the surface of the target material, and the potential of the cathode drop zone decreases accordingly. Finally, the potential drop of the cathode drop zone decreases to zero, the discharge is extinguished, and the sputtering stops. This phenomenon is called "target poisoning". .
       The reactive sputtering technology of vacuum coating machine has been applied to many fields, such as the field of large-area glass coating: low-e glass, sunlight control glass, automotive glass, solar cells; semiconductor. Electronic coating field: MEMS, electronic components, LED, LCD, etc.; magnetic disk, hard disk coating field: ferromagnetic film. Decorative coating field: watch case, mobile phone case, notebook case, and accessories, etc.; different film layers (film systems) can be modulated in a variety of colors, etc.