Magnetron sputtering pvd coating machine coating substrate, merchants often consider whether the process meets their needs, as well as the finished product, how to control the uniformity of the film, there are many products on the market that have very high requirements for the uniformity of the coating film, such as Electronic products, mechanical parts, and some other daily applications on the market have very high requirements for film uniformity. Therefore, many merchants will pay more attention to this series of problems when purchasing magnetron sputtering pvd coating machine.

      Magnetron sputtering pvd coating machine coating film uniformity is an important indicator, so it is necessary to study the influencing factors of magnetron sputtering uniformity, in order to better achieve magnetron sputtering uniform coating. Simply put, magnetron sputtering is in the orthogonal electromagnetic field, the closed magnetic field binds the electrons to make a spiral motion around the target surface, and continuously hits the working gas argon during the movement to ionize a large number of argon ions, and the argon ions are under the action of the electric field. Accelerate the bombardment of the target, sputter out the target atomic ions (or molecules) and deposit them on the substrate to form a thin film. Therefore, in order to achieve a uniform coating, it is necessary to uniformly sputter the target atomic ions (or molecules), which requires the argon ions bombarding the target to be uniformly bombarded. Since argon ions are accelerated to bombard the target under the action of an electric field, the electric field is required to be uniform. However, in the actual magnetron sputtering device, some factors are difficult to be completely uniform, so it is necessary to study the influence of their non-uniformity on the uniformity of film formation. In fact, the uniformity of the magnetic field and the uniformity of the working gas are the most important factors affecting the uniformity of the film formation. Where the magnetic field is large, the film is thick, whereas the film is thin, and the direction of the magnetic field is also an important factor affecting the uniformity. In terms of air pressure, under certain air pressure conditions, the film is thicker at the position where the air pressure is high, and the film is thinner on the contrary.
       In daily life, we will also see the problem of uneven coating of the magnetron sputtering pvd coating machine. Generally, when we deal with it, we must first try to ensure the uniformity and direction consistency of the magnetic field to form a relatively uniform spatial magnetic field. Then, it is necessary to ensure the uniformity of the air pressure up and down as much as possible. When designing the vacuum chamber, the installation position of the vacuum pump, the intake method of the process gas and the layout of the process gas pipe in the chamber should be considered. Finally, since neither the magnetic field nor the air pressure can be absolutely ideal, the unevenness of the magnetic field can be compensated by the unevenness of the air pressure, so that the final film is uniform. Finally, the target-to-base distance is also an important factor affecting the uniformity of the sputtered coating film.