The distribution of the magnetic field on the target surface affects the coating efficiency of the magnetron sputtering pvd coating machine. There are many types of targets that have been developed, such as twin targets, cylindrical targets, flat targets, etc. The design of these targets can be improved to varying degrees. coating efficiency.

For the target distribution in the pvd coating machine, the magnetic field covering the target surface cannot be uniformly distributed in the previous target design, resulting in uneven plasma generation, which affects the uniformity of film formation and reduces the target utilization rate. In order to solve this problem, the researchers tried to put some kind of ferromagnet between the target and the magnetic pole, and changed the magnetic field distribution by magnetism to make the distribution more uniform, which improved the utilization rate of the target material by 6%. This method is called shunting design, but at the same time due to the influence of ferromagnets, the magnetic field strength of the target surface is reduced, and the utilization rate of the magnetic flux is not so high.
       There is a design of a circular target. Since the ordinary target is similar to a circular shape after being eroded during the coating process, in order to make better use of the target material, the target surface is designed to be circular. Compared with the ordinary target, the coating of the same amount of products , the working voltage, pressure and workpiece temperature required by the circular target are relatively reduced, that is to say, under the same conditions, the output of the circular target is higher, and the low temperature can increase the selection range of the workpiece, such as plastic with a low melting point. Coating is performed.
       There is also a design of full target ablation. This target is rectangular, using the same magnetic pole direction and alternately arranged magnetic pole directions, to increase the distance between the magnetic circuits and the thickness of the isolation iron, so that the discharge before each other The influence will be greatly reduced, or even eliminated, thereby reducing the working voltage, and the working pressure can also be reduced by increasing the number of magnetic poles.
        By adjusting the magnetic field distribution on the target surface of the magnetron sputtering pvd coating machine, the target material can be used more effectively, the working voltage can be reduced, and the efficiency of the magnetron sputtering coating can be greatly improved.