Thin film deposition technology can be divided into physical, chemical and epitaxial processes according to different film formation mechanisms. Physical vapor deposition coating equipment, referred to as PVD vacuum coating machine. Chemical vapor deposition coater, referred to as CVD machine.

Thin film deposition technology is an essential key process for the development of semiconductor, photovoltaic and other industries. Thin film deposition technology refers to the technology that vapor phase atoms or molecules obtained by various methods under vacuum are deposited on the surface of the substrate material to obtain the separation layer coating. It is not only suitable for preparing super hard, corrosion resistant, heat resistant and oxidation resistant mechanical films, but also suitable for preparing functional films such as magnetic recording, information storage, photosensitive, thermosensitive, superconducting and photoelectric conversion films; In addition, it can also be used to prepare decorative coatings. In the past 20 years, thin film deposition technology has been developed rapidly and has been widely used in machinery, electronics, decoration and other fields.

PVD vacuum coating machine is characterized by fast deposition speed, low deposition temperature, environmentally friendly physical means, and more suitable for coating of carbide precision and complex tools. PVD refers to bombarding the target with high temperature evaporation or high-energy particles and other physical methods under vacuum conditions to "evaporate" the atoms on the target surface and deposit them on the substrate surface. With high deposition rate, it is generally applicable to planar deposition of various metal, non-metal and compound films. According to the difference of physical mechanism during deposition, PVD is generally divided into vacuum evaporation coating, vacuum sputtering coating, ion coating and molecular beam epitaxy. In recent years, the development of thin film technology and thin film materials has made remarkable progress. On the original basis, ion beam enhanced deposition technology, electric spark deposition technology, electron beam physical vapor deposition technology and multi-layer spray deposition technology have emerged.
CVD coating equipment has a wide range. At present, PECVD is the mainstream technology, and its market share is expected to further increase in the future. CVD refers to the process of using gaseous or vapor substances to react on the gas phase or gas-solid interface to generate solid deposits. It is a new technology developed in recent decades to prepare inorganic materials. Chemical vapor deposition (CVD) has been widely used to purify substances, develop new crystals, and deposit various single crystal, polycrystalline or glassy inorganic film materials. These materials can be oxides, sulfides, nitrides, carbides, or binary or multi-element intermetallic compounds in III-V, II-IV, IV-VI families, and their physical functions can be precisely controlled by the deposition process of gas doping. CVD coating has good repeatability and step coverage, and can be used for deposition of SiO2, Si3N4, PSG, BPSG, TEOS and other dielectric films, as well as semiconductor, metal (W), and various metal organic compound films. There are many kinds of CVDs, which can be roughly divided into APCVD, LPCVD, SACVD, PECVD, MOCVD, etc. according to the chamber pressure, external energy, etc. CVD equipment has easy access to reaction sources, diverse coating components, and relatively simple equipment, which is particularly suitable for coating on the surface and inner holes of parts with complex shapes.