When we talk about the magnetron sputtering coating machine everyday, we are familiar with Nengxiang. We also know what products can be coated by the magnetron vacuum coating machine. But when we ask about the principle of the coating technology of the magnetron sputtering coating machine, what coating technology is used? But few of them can answer the question. Now we have compiled a small vacuum compilation to explain it in detail. I hope it can help you?

Principle of magnetron sputtering coating machine coating technology:
The electrons collide with argon atoms in the process of accelerating their flight to the substrate under the effect of electric field, ionizing a large number of argon ions and electrons. The electrons fly to the substrate. The argon ions accelerate their bombardment of the target under the effect of electric field, splashing a large number of target atoms, and the neutral target atoms (or molecules) are deposited on the substrate to form a film. The secondary electrons are bound in the plasma area near the target surface due to the influence of the magnetic field Loren magnetic force when accelerating to the substrate. The plasma density in this area is very high. The secondary electrons move around the target surface circularly under the action of the magnetic field. The path of the electrons is very long. During the movement, they constantly collide with argon atoms and ionize a large number of argon ions to bombard the target. The energy of the electrons gradually decreases after multiple collisions, Get rid of the bondage of magnetic lines of force, stay away from the target, and finally deposit on the substrate. Magnetron sputtering is to use magnetic field to restrain and extend the movement path of electrons, change the movement direction of electrons, improve the ionization rate of working gas and effectively use the energy of electrons.
The destination of electrons is not only the substrate, but also the wall of the vacuum chamber and the anode of the target source. However, generally, the substrate, the vacuum chamber and the anode are at the same potential, and the interaction of magnetic field and electric field (E  X  B  shift) makes the single electron trajectory appear three-dimensional spiral, rather than just moving in a circle on the target surface. As for the circular sputtering profile of the target surface, That is, the magnetic force lines of the target source magnetic field are in a circular shape. The different distribution directions of the magnetic force lines will have a great impact on the film formation.
The non light magnetron sputtering, multi arc plating target source, ion source and plasma source working under the principle all work under the sub principle, but the difference is the electric field direction, voltage and current size.