The distribution of target magnetic field affects the coating efficiency of Magnetron sputtering vacuum deposition equipment. There are many types of targets that have been developed, such as twin targets, cylindrical targets, planar targets, etc. The design of these targets can improve the coating efficiency to varying degrees.

For the target distribution in the vacuum deposition equipment, the target design failed to achieve uniform distribution due to the magnetic field covering the target surface, resulting in uneven plasma, which affects the uniformity of film formation and reduces the utilization rate of target materials. To solve this problem, researchers attempted to place a certain type of ferromagnet between the target and the magnetic pole, changing the magnetic field distribution through magnetism to make it more uniform and improve the target material utilization rate by 6%. This method is called shunt design, but at the same time, due to the influence of ferromagnets, the magnetic field intensity on the target surface is reduced, and the utilization rate of magnetic flux is not as high.

There is a design of a circular target, which is similar to the circular shape displayed by ordinary targets during the coating process. In order to better utilize the target material, the target surface is designed as a circular shape. Compared with ordinary targets, the working voltage, pressure, and workpiece temperature required for circular targets are relatively lower for coating equal quantities of products. That is to say, under the same conditions, the output of circular targets is higher, while lower temperatures can increase the range of workpiece selection, Plastics with low melting points can also be coated.

Another design is full target erosion, which is rectangular and uses the same magnetic pole direction and alternating magnetic pole directions to increase the distance between the magnetic circuits and the thickness of the isolation iron. This greatly reduces or even eliminates the impact of previous discharge, thereby reducing the working voltage. By increasing the number of magnetic poles, the working pressure can also be reduced.

By adjusting the magnetic field distribution on the target surface of the Magnetron sputtering coating equipment, the target can be used more effectively, the working voltage pressure can be reduced, and the efficiency of Magnetron sputtering coating can be greatly improved.