Many products on the market are coated by Magnetron sputtering. Magnetron sputtering technology is the most common coating method and is also favored by many pvd coating machine manufacturers. So what are the advantages of Magnetron sputtering coating film on pvd coating machine? Let's summarize it into a vacuum series to introduce in detail:

The vacuum deposition is conducted by sputtering method. Due to the different coating methods, the effect of the film prepared by the same plating material will be different. Although it cannot be seen by the naked eye, it does have certain advantages.
The stability of the film thickness is good. Due to the significant relationship between the thickness of the sputtering coating layer and the target current and discharge current, the higher the current, the greater the sputtering efficiency. Within the same time, the thickness of the coating layer is relatively large. As long as the current value is controlled properly, the thickness of the coating layer can be as thick or as thin as possible. Of course, this thickness is within the allowable range, and the current is controlled well, no matter how many times the coating is repeated, The thickness of the film does not change, and the stability of the film thickness can be attributed to its good controllability and repeatability.
The film layer has strong adhesion. During the sputtering process, some electrons collide with the surface of the substrate, activating surface atoms and producing a cleaning effect. The energy obtained by sputtering is 1 to 2 orders of magnitude higher than that obtained by evaporation. When atoms with such high energy collide with the substrate surface, more energy can be transferred to the substrate, generating more heat energy and accelerating the movement of atoms activated by electrons, Some of the plated material atoms dissolve with each other earlier, while other plated material atoms gradually deposit into a film, strengthening the adhesion between the film layer and the substrate.
The range of plating materials is wide. Because the pvd coating machine sputters the coating materials through the high-speed bombardment of argon ions, unlike the evaporation coating, which is limited to the use of plating materials with low melting point due to the melting point, almost all solid materials of the sputtered coating can be used as plating materials.
From the above points, it can be seen that sputtering vacuum deposition is indeed better than evaporating vacuum deposition. Different principles determine that the thickness of the sputtered film is more stable, the adhesion is stronger, and the range of plating materials is wider.