pvd coating machine sputtering coating method is widely used in various fields, magnetron sputtering coating method is already the vacuum plating industry, the most conventional and most widely used a coating technology, although this coating technology, collectively known as magnetron sputtering coating technology, but the magnetron coating technology is also divided into several kinds, The following Huicheng vacuum small series for you to introduce the characteristics of the types of magnetron sputtering coating technology:

1) DC diode sputtering. The structure is simple, uniform film can be prepared on a large area substrate, and the discharge current changes with the change of pressure and voltage.
2) Triple or quadrupole sputtering. Low pressure, low voltage sputtering can be achieved, and the discharge current and the ion energy of the bombarding target can be independently controlled. Can control the target current, also can be RF sputtering;
3) Magnetron sputtering (or high-speed, low-temperature sputtering). The magnetic field is applied in the direction parallel to the target surface, and the magnetron principle that the electric field and the magnetic field are orthogonal is used to reduce the bombardment of electrons on the substrate and realize high-speed and low temperature sputtering.
4) Sputter against the target. The two targets are placed in opposite directions, and the magnetic field is added in the direction perpendicular to the surface of the target, so that the magnetic materials can be sputtered at high speed and low temperature;
5) RF sputtering. For the preparation of insulating film, such as silicon oxide, alumina, glass film, etc., can also sputter metal;
6) Reactive sputtering. Can make cathode material compound film, such as titanium nitride, silicon carbide, aluminum nitride, alumina, etc.;
7) Bias sputtering. During the coating process, the light weight charged particles on the substrate are removed at the same time, so that the substrate does not contain impure gas;
8) Asymmetric AC sputtering. The target is sputtered in the half period with large amplitude, and the substrate is bombarded with ions in the half period with small amplitude, and the adsorbed gas is removed to obtain the high purity film.
9) Ion beam sputtering. In high vacuum, using ion beam sputtering coating, non-plasma state film formation process. The target ground potential can also be;
10) Inspiratory sputtering. By the inspiratory effect of sputtering particles, the impure gas can be removed and the film with high purity can be obtained.
General manufacturing equipment manufacturers, called the use of magnetron sputtering coating technology coating equipment, referred to as magnetron sputtering pvd coating machine, plating products are not the same, the demand is not the same, the use of magnetron sputtering coating technology is also some differences.