For the coating substrate of magnetron sputtering pvd coating machine, merchants often consider whether the process meets their needs, and how to control the uniformity of the coated finished product. There are many products on the market that have very high requirements for the uniformity of the coating film, such as Electronic products, mechanical parts, and some other daily applications in the market require very high uniformity of films, so many businesses will pay more attention to this series of issues when purchasing magnetron sputtering coating machines.

 The uniformity of the coating film of the magnetron sputtering pvd coating machine is an important index, so it is necessary to study the influencing factors that affect the uniformity of the magnetron sputtering, so as to better realize the uniform coating of the magnetron sputtering. Simply put, magnetron sputtering is in the orthogonal electromagnetic field, the closed magnetic field binds the electrons to do spiral motion around the target surface, and continuously impacts the working gas argon gas during the movement to ionize a large number of argon ions. Accelerated bombardment of the target, sputtering target atomic ions (or molecules) deposited on the substrate to form a thin film. Therefore, in order to achieve a uniform coating, it is necessary to uniformly sputter out target atomic ions (or molecules), which requires that the argon ions bombarding the target be uniformly bombarded. Since argon ions are accelerated to bombard the target under the action of an electric field, the electric field is required to be uniform. However, in the actual magnetron sputtering device, some factors are difficult to be absolutely uniform, so it is necessary to study the influence of their inhomogeneity on the uniformity of film formation. In fact, the uniformity of the magnetic field and the uniformity of the working gas are the most important factors affecting the uniformity of film formation. Where the magnetic field is large, the film is thick, otherwise the film is thin, and the direction of the magnetic field is also an important factor affecting the uniformity. In terms of air pressure, under certain air pressure conditions, the film is thicker at the position where the air pressure is higher, and the film is thinner at the opposite.
In daily life, we will also see the unevenness of the coating film of the magnetron sputtering pvd coating machine. Generally, when we deal with it, we must first try to ensure the uniformity and direction of the magnetic field to form a relatively uniform spatial magnetic field. Then, try to ensure the uniformity of the air pressure up and down. When designing the vacuum chamber, the installation position of the vacuum pump, the inlet method of the process gas and the layout of the process gas pipe in the chamber should be considered. Finally, since neither the magnetic field nor the air pressure is absolutely ideal, the uneven magnetic field can be compensated by the uneven air pressure, so that the final film is uniform. Finally, the target base distance is also an important factor affecting the uniformity of the sputtered coating film