pvd coating machine mainly refers to a type of coating that needs to be carried out under a relatively high degree of vacuum, including many types, including vacuum ion evaporation, magnetron sputtering, MBE molecular beam epitaxy, PLD laser sputtering deposition, etc. Evaporative coating generally heats the target to evaporate surface components in the form of atomic groups or ions. And it settles on the surface of the substrate to form a thin film through the film formation process (scattered point-island structure-vagus structure-layered growth). For sputtering coating, it can be simply understood as using electrons or high-energy laser to bombard the target, causing the surface components to be sputtered out in the form of atomic groups or ions, and finally deposited on the surface of the substrate, undergoing a film-forming process, and finally forming a thin film. 

High vacuum electron beam evaporation coating machine uses electron beam bombardment to heat and evaporate materials under high vacuum conditions to plate various metals, oxides, conductive films, optical films, semiconductor films, ferroelectric films, etc. on the substrate. Super hard film, etc.; can be plated to form mixed single-layer films, multi-layer films or doped films; can be plated with various high melting point materials.
According to user requirements, two modes of automatic control of quartz crystal film thickness and automatic control of optical film thickness can be selected. Through the combination of PLC and industrial computer, full automatic control of the entire coating process, including vacuum system, baking system, and evaporation process, can be realized. and film thickness monitoring functions, etc., thereby improving work efficiency and ensuring the consistency and stability of product quality.
The high vacuum electron beam evaporation pvd coating machine has the characteristics of high vacuum degree, fast pumping speed, and convenient substrate loading and unloading. It is equipped with E-type electron beam evaporation source and resistance evaporation source. PID automatic temperature control has the advantages of uniform film formation, small gas release and uniform temperature. E-type electron beam evaporation gun, resistance thermal evaporation source assembly (optional), sample mask baffle system, vacuum acquisition system and vacuum measurement system, molecular pump vacuum unit or cryogenic pump vacuum unit, rotating substrate heating stage, working It is composed of gas path, sample transfer mechanism, film thickness control system, electronic control system, constant temperature cooling water system, etc. Optional parts: film thickness monitor, constant temperature refrigeration water tank.