With the continuous improvement of people's living standards, magnetron sputtering technology of vacuum coating equipment is more and more in line with people's needs, and has been applied in more and more fields. Compared with evaporation coating technology and ion plating technology, magnetron sputtering coating technology will have higher coating quality, stronger adhesion, more detailed film structure and smoother surface. Therefore, most of them have higher requirements for workpiece film, and most of them choose magnetron sputtering technology of vacuum coater. The following are series of vacuum coatings for everyone to introduce in detail.

In 1842 Grove discovered the phenomenon of cathode sputtering in the laboratory. He discovered the phenomenon that the cathode material would migrate to the vacuum tube wall when he studied the cathode corrosion of electronic tubes. Since 1870, the sputtering principle has been applied to the preparation of thin films, but the development of sputtering technology has been slow in the past 100 years. After 1940, it was found that the sputtering film had excellent performance, and various new processes to improve sputtering equipment and sputtering rate appeared one after another and reached the practical level, which made sputtering technology develop rapidly and be widely used in industry.

The so-called "sputtering" refers to the phenomenon that charged particles bombard the solid surface (target), so that solid atoms (or molecules) are ejected from the surface. Most of the ejected particles are in atomic state, which is usually called sputtered atoms. The charged particles used to bombard the target may be electrons, ions or medium-sized particles. Because ions are easy to accelerate and obtain the required kinetic energy under the electric field, most of them are used as bombardment particles. This particle is also called incident ion. Because the mechanism of sputtering directly is ions, this coating technology is also called ion sputtering coating or deposition.

There are many kinds of magnetron sputtering coating technology in vacuum coating machine in detail:

1) DC diode sputtering. The structure is simple, a uniform thin film can be prepared on a large area substrate, and the discharge current changes with the change of pressure and voltage;

2) Three-pole or four-pole sputtering. Low pressure and low voltage sputtering can be realized, and discharge current and ion energy of bombarding target can be independently controlled. The target current can be controlled, and RF sputtering can also be performed.

 3) magnetron sputtering (or high-speed and low-temperature sputtering). The magnetic field is applied in the direction parallel to the target surface, and the magnetron principle that the electric field is orthogonal to the magnetic field is used to reduce the bombardment of electrons on the substrate and realize high-speed and low-temperature sputtering.

4) sputtering against the target. Two targets are placed oppositely, and a magnetic field is applied in the direction perpendicular to the surfaces of the targets, so that magnetic materials and the like can be sputtered at high speed and low temperature;

5) RF sputtering. Developed for making insulating films, such as silicon oxide, aluminum oxide, glass film, etc., or sputtering metal;

6) reactive sputtering. Compound films of cathode materials, such as titanium nitride, silicon carbide, aluminum nitride, aluminum oxide, etc.

7) bias sputtering. In the coating process, light charged particles on the substrate are removed at the same time, so that the substrate does not contain impure gas;

8) Asymmetric AC sputtering. Sputtering the target in a half-cycle with large amplitude, and ion bombarding the substrate in a half-cycle with small amplitude to remove adsorbed gas, so as to obtain a high-purity thin film;

9) Ion beam sputtering. Under high vacuum, sputtering coating with ion beam is a non-plasma film forming process. The ground potential of that target may also be;

10) inspiratory sputtering. The impure gas can be removed by utilizing the suction effect of sputtered particles, and a thin film with high purity can be obtained.