There are many kinds of magnetron sputtering, which are divided into DC magnetron sputtering, radio frequency magnetron sputtering, unbalanced magnetron sputtering, intermediate frequency magnetron sputtering, etc. Each has different working principles and application objects, but they have one thing in common: the interaction between the magnetic field and the electrons makes the electrons run in a spiral shape near the target surface, thereby increasing the probability of the electrons hitting the argon gas to generate ions. The generated ions hit the target surface under the action of an electric field to sputter out the target. Medium frequency magnetron sputtering vacuum coating machine coating technology is widely used in daily life, so what are the differences and characteristics between it and other magnetron sputtering?

        The intermediate frequency dual-target reactive magnetron sputtering method has many excellent properties, and many things cannot be achieved by ordinary DC magnetron sputtering or RF sputtering. The characteristics are as follows:
        (1) The medium frequency dual target reactive magnetron sputtering refers to the high quality of the film, the uniformity of the film formation and the structural characteristics are also due to the DC reactive sputtering method.
        (2) The medium-frequency dual-target reactive magnetron sputtering has a high deposition rate. For silicon targets, the deposition rate of medium-frequency reactive sputtering is 10 times that of DC reactive sputtering and about 5 times higher than that of RF sputtering.
        (3) The medium-frequency double-target Sanskrit magnetron sputtering process can be stabilized at the set working point, which not only eliminates the "sparking" phenomenon, but also overcomes the common phenomenon of target poisoning and anode disappearance in the state of DC discharge
        (4) The production cost of the intermediate frequency power supply is lower, the equipment installation, debugging and maintenance are easier than RF sputtering, the operation is stable, and the matching of the intermediate frequency power supply and the target is easier than that of the radio frequency power supply.
        (5) The substrate temperature is higher, which is conducive to improving the quality and bonding force of the film
        (6) Intermediate frequency dual-target reactive magnetron sputtering can achieve a sputtering rate similar to that of DC sputtering. Some studies have shown that the reactive sputtering deposition rate obtained with this method can reach 60% to 70% of the metal sputtering rate. And RF sputtering is usually an order of magnitude lower than DC sputtering.
        Medium frequency magnetron sputtering vacuum coating machine coating technology double target reactive magnetron sputtering has been applied in industrial production due to its high deposition rate and good working stability, and has received increasing attention.