Magnetron sputtering coating technology has a series of typical advantages, such as lower deposition temperature, high speed and defect free ceramic film deposition For example, when depositing oxide films, traditionally, metal targets can be used for reactive sputtering deposition in an appropriately controlled oxygen atmosphere, or RF (generally 13156MHz) sputtering oxide target deposition. However, these two methods have limitations. RF sputtering can obtain high-quality films, but the deposition rate is extremely low（ μ M/h), the system is complex and difficult to realize commercial application

The coating technology of magnetron sputtering  coating machine has a series of typical advantages, such as lower deposition temperature, high-speed, defect free ceramic film deposition, etc. For example, when depositing oxide films, it is traditionally possible to use metal targets, reactive sputtering deposition in an appropriately controlled oxygen atmosphere, or RF (13156MHz in general) sputtering oxide target deposition. However, these two methods have limitations. RF sputtering can obtain high-quality films, but the deposition rate is extremely low（ μ M/h), the system is complex and difficult to achieve commercial applications. The problem during reactive sputtering is that the target is poisoned. During reactive sputtering, the non main glow area on the target surface is covered by insulating deposits, which leads to the insulation of the target and the charge accumulation in the insulating layer until the arc discharge occurs; The arc discharge makes the target components evaporate in the form of droplets, resulting in various film defects when deposited on the substrate surface, such as loose film structure, coarse grains, composition or structure segregation, which has a very adverse impact on the performance of the film, especially the optical and corrosion resistance. The pulsed magnetron sputtering technology can effectively inhibit the generation of arc and eliminate the resulting film defects, and can greatly improve the sputtering deposition rate, which is 10% of the deposition rate of pure metal μ m/h。 In the process of pulse sputtering, the pulse voltage applied to the target is the same as that applied to general magnetron sputtering (400~500V). Control the time for applying voltage to the target to discharge, so as to ensure that the target is not poisoned and there is arc discharge; Then disconnect the target voltage and even make the target positively charged. Because the electron velocity in the plasma is much higher than the ion velocity, the converted positive voltage of the target generally only needs 10%~20% of the negative bias voltage, which can prevent arc discharge (such power supply is called asymmetric bipolar DC power supply).
Some studies believe that when the pulse frequency is lower than 20kHz, the arc discharge can not be suppressed. When the pulse frequency is higher than 20kHz, the arc discharge can be completely suppressed. At the same time, the pulse width (the ratio of positive and negative voltage time) plays a key role. When the pulse width reaches 1 ∶ 1, the suppression effect is achieved; The positive voltage has no obvious effect on whether the arc discharge occurs, but greatly affects the deposition rate. When the positive voltage is increased from 10% to 20% (compared with the negative voltage), the deposition rate can be increased by 50%. This effect is considered that high positive voltage can enhance the cleaning of the target. With PMS technology, bipolar magnetron sputtering can be carried out. Two magnetron sputtering targets are used as positive and negative poles respectively. During the working process, one target is sputtered and the other target is cleaned in a cycle. This technology has many advantages, such as long time (300h) stable operation, and has an important application in the deposition of optical films for buildings, automobiles, and polymer materials. Another recent development is to add pulse bias to the substrate. Pulsed bias can greatly improve the ion beam current on the substrate. In magnetron sputtering, when the DC negative bias voltage is generally added to - 100V, the substrate ion beam current reaches saturation. Increasing the negative bias voltage will not increase the substrate ion beam current. It is generally considered that the saturated current is an ion beam current, and electrons cannot approach the substrate surface. The results show that pulse bias can not only increase the saturation current of substrate, but also increase the saturation current with the increase of negative bias; When the pulse frequency increases, the effect becomes more typical; The mechanism is still unclear, which may be related to the ionization rate of plasma produced by oscillating electric field and the effect of higher electron temperature. The negative substrate pulse bias provides a new means to effectively control the substrate current density. This effect can be applied to optimize the film structure, adhesion, and shorten the sputtering cleaning and substrate heating time. With the progress of machinery, power supply, control and other related technologies, magnetron sputtering technology will be further developed. For example, in the near future, due to the application of rare earth magnets, the magnetic field strength on the target surface was only 300~500Gs in the past, but now it has been increased to 1kGs, which further improves the efficiency and capability of magnetron sputtering.
Magnetron sputtering technology has been widely used in the fields of building materials, decoration, optics, corrosion prevention, tools and abrasives strengthening in China. The preparation of functional films such as photoelectric, photothermal, magnetic, superconducting, dielectric and catalytic films by using magnetron sputtering technology is a hot research topic at present. However, there are few domestic units to understand and study the coating technology of unbalanced magnetron sputtering coating machine, especially the new deposition process. After searching, it is found that there are less than 20 relevant Chinese scientific research articles so far, and the number of author units is even smaller. Anticorrosion and high hardness films can play an important role in improving the performance and service life of petroleum machinery. When functional films with low friction coefficient, lubrication, anti sludge package, catalysis, optics, etc. are applied in the petrochemical industry, they are expected to significantly improve the work efficiency, product quality, environmental protection, safety, etc. With the development and application of new magnetron sputtering technology and process, the petroleum and chemical industries have increased their demands for improving production efficiency, environmental protection, safety, etc. The importance of magnetron sputtering technology in the petroleum and chemical industries will continue to increase。