The magnetron sputtering coating technology has a series of typical advantages, such as lower deposition temperature, high-speed, defect-free ceramic film deposition, etc. For example, when depositing oxide films, metal targets can be traditionally used for reactive sputtering deposition in an appropriately controlled oxygen atmosphere, or sputtering oxide target deposition at a frequency (generally 13156MHz). However, these two methods have limitations. RF sputtering can obtain high-quality films, but the deposition rate is very low（ μ M/h level), the system is complex and difficult to realize commercial application

The magnetron sputtering coating machine coating technology has a series of typical advantages, such as lower deposition temperature, high-speed, defect-free ceramic film deposition, and so on. For example, when depositing oxide thin films, metal targets, reactive sputtering deposition in an appropriate controlled oxygen atmosphere, or RF (generally 13156MHz) sputtering oxide target deposition can be used traditionally. However, these two methods have limitations. RF sputtering can obtain high-quality films, but the deposition rate is very low（ μ M/h level), the system is complex and difficult to realize commercial application. The problem in reactive sputtering is target poisoning. During reactive sputtering, the non-main glow area on the surface of the target is covered by insulating deposits, resulting in the insulation of the target and the charge accumulation of the insulating layer until the occurrence of arc discharge; The arc discharge makes the target components evaporate in the form of liquid droplets, and when deposited on the substrate surface, it causes various film defects, such as loose film structure, coarse grain, composition or structure segregation, which has a very adverse impact on the performance of the film, especially optical and corrosion resistance. Pulse magnetron sputtering technology can effectively inhibit the arc generation and eliminate the resulting film defects, and can greatly improve the sputtering deposition rate to reach the rate of deposition of pure metal, which is 10 μ m/h。 In the process of pulse sputtering, the pulse voltage applied to the target is the same as that of general magnetron sputtering (400~500V). The time of applying voltage to the target for discharge is controlled to ensure that the target is not poisoned or arced; Then disconnect the target voltage and even make the target positively charged. Because the electron movement speed in the plasma is much higher than the ion speed, the positive voltage of the transformed target generally only needs 10%~20% of the negative bias voltage, which can prevent arc discharge (such power supply is called asymmetric bipolar DC power supply).
Some studies believe that when the pulse frequency is lower than 20 kHz, the arc discharge cannot be suppressed. When the pulse frequency is higher than 20 kHz, the arc discharge can be completely suppressed. At the same time, the pulse width (the ratio of positive and negative voltage time) plays a key role. When the pulse width reaches 1 ∶ 1, the arc discharge can be suppressed; The size of positive voltage has no obvious influence on whether arc discharge occurs, but it greatly affects the deposition rate. When the positive voltage is increased from 10% to 20% (compared with negative voltage), the deposition rate can be increased by 50%. This effect is believed to be that high positive voltage can enhance the cleaning of the target. Using PMS technology, bipolar magnetron sputtering can be carried out. Two magnetron sputtering targets are used as positive and negative poles respectively. During the working process, one target is sputtered and the other target is cleaned. This technology has many advantages, such as stable operation for a long time (300h), and has important applications in the deposition of optical films for buildings, automobiles, and polymeric materials. Another recent development is to add pulse bias to the substrate. Pulse bias can greatly increase the ion beam current on the substrate. In magnetron sputtering, when the DC negative bias voltage is generally increased to - 100V, the substrate ion beam current will reach saturation. Increasing the negative bias voltage will not increase the substrate ion beam current. Generally, the saturation current is considered as the ion beam current, and the electrons cannot approach the substrate surface. The results show that the pulse bias can not only increase the saturation current of the substrate, but also increase with the increase of the negative bias; When the pulse frequency increases, the effect is more typical; The mechanism is still unclear, which may be related to the effect of high ionization rate and electron temperature of the plasma produced by the oscillating electric field. The negative substrate pulse bias voltage provides a new means to effectively control the current density of the substrate. This effect can be applied to optimize the structure and adhesion of the film, and shorten the sputtering cleaning and substrate heating time. With the progress of mechanical, power, control and other related technologies, magnetron sputtering technology will be further developed. For example, in the near future, due to the application of rare earth magnets, the magnetic field intensity on the target surface was only 300~500Gs in the past, but now it has increased to 1kGs, making the efficiency and ability of magnetron sputtering further improved.
The magnetron sputtering technology has been widely used in the fields of building materials, decoration, optics, corrosion prevention, and strengthening of tools and abrasive tools in China. The preparation of functional films such as photoelectricity, photothermal, magnetism, superconductivity, dielectric, and catalysis by using magnetron sputtering technology is the current research focus. However, there are few domestic units that understand and study the coating technology of unbalanced magnetron sputtering coating machine, especially the new deposition technology. After searching, it is found that so far there are less than 20 relevant scientific research articles in Chinese, and the number of author units is less. Anti-corrosion and high-hardness films can play an important role in improving the performance and service life of petroleum machinery. When functional films such as low friction coefficient, lubrication, anti-sludge bag, catalysis and optics are applied to the petrochemical industry, they are expected to significantly improve work efficiency, product quality, environmental protection and safety. With the development and application of new magnetron sputtering technology and process, and the increasing demand of petroleum and chemical industry for improving production efficiency, environmental protection and safety, the importance of magnetron sputtering technology in petroleum and chemical industry will continue to increase.