Sputtering coating technology is widely used in the market. Decorations, electronic products, hardware, etc. can not be separated from the application of the coating layer of the coating machine in this field. When we talk about the coating technology, we will think of the magnetron sputtering coating technology. So what is the principle of the magnetron sputtering vacuum coating machine sputtering technology?

Sputtering coating technology is widely used in the market. Decorations, electronic products, hardware, etc. can not be separated from the application of vacuum coating machine in this field. When we talk about coating technology, we will think of magnetron sputtering coating technology. So what is the principle of magnetron sputtering vacuum coating technology? The following is a brief introduction to the technical principle of magnetron sputtering vacuum coating machine?
Sputtering: generally refers to magnetron sputtering, which belongs to high-speed and low-temperature sputtering method. This skill requires a vacuum of 1 × 10-3 Torr, i.e. 1.3 × A 10-3Pa vacuum is filled with inert gas argon (Ar), and a high-voltage DC is applied between the plastic substrate (anode) and the metal target (cathode), because the electrons generated by glow discharge excite the inert gas and generate plasma, which blows out the atoms of the metal target and accumulates on the plastic substrate
The charged particles with dozens of electron volts or higher kinetic energy bombard the surface of the data to make it splash into the gas phase, which can be used for etching and coating. The number of atoms ejected by an incident ion is called the sputtering yield. The higher the yield, the faster the sputtering speed. Cu, Au, Ag, etc. are the highest, and Ti, Mo, Ta, W, etc. are the lowest. It is generally 0.1-10 atom/ion. The ions can be discharged by DC glow discharge. At 10-1 to 10 Pa vacuum, high voltage is applied between the two electrodes to generate the discharge. The positive ions will bombard the negatively charged target and sputter the target, which will be plated on the coating.
The current density of normal glow discharge is related to the shape of cathode material and the pressure of gas species. Keep it as stable as possible when splashing. Any data can be sputtered, and even high melting point data can be simply sputtered, but non-conductive targets must be sputtered by radio frequency (RF) or pulse (pulse); Due to poor conductivity, the sputtering power and speed are low. The power of metal splashing can reach 10W/cm2, and nonmetal<5W/cm2
The sputtering machine is composed of vacuum chamber, exhaust system, sputtering source and control system. The sputtering source is also divided into power supply and sputtering gun. The magnetron sputtering gun is divided into plane type and cylindrical type. The plane type is divided into rectangular type and circular type. The utilization rate of target data is 30-40%. The utilization rate of cylindrical target data is more than 50%. The sputtering power supply is divided into DC, RF, pulse, DC: 800-1000V (Max) conductor, which must be able to prevent arcing.
The operation method of magnetron sputtering is similar to that of general evaporation plating. First, the vacuum is pumped to 1 × 10-2Pa, and then inject argon (Ar) ion to bombard the target at 5 × Pay attention to current, voltage and pressure during splashing at 10-1-1.0Pa. If there is a spark in the splash plating at the beginning, the voltage can be slowly increased, and the shutter can be turned off after the stable discharge In this process, the ionized inert gas (Ar) cleans and exposes several fine pores on the surface of the plastic substrate, and generates a free radical through the cleaning of the electron and the surface of the self-plastic substrate, and forms the external connective structure by splashing under the vacuum condition, so that the external connective structure and the free radical are filled and chemically and physically connected with high adhesion, so as to form the film stably outside the surface In the meantime, the film is formed by filling the plastic wool fiber pores with the surface creation roughly and then connecting them.
Compared with the commonly used transpiration plating, sputtering has the advantages of strong connection between the plating layer and the substrate - the adhesion is more than 10 times higher than that of transpiration plating, and the plating layer is fine and uniform. Vacuum evaporation needs to vaporize the metal or metal oxide, but the heating temperature should not be too high. Otherwise, the metal gas will accumulate on the plastic substrate and burn the plastic substrate. The sputtering particles are not affected by gravity, and the orientation of the target and substrate can be organized freely, The film has high nucleation density in the early stage of formation, and can produce extremely thin continuous films below 10nm. The target has a long life and can be produced automatically for a long time.
The target material can be made into various shapes. The special design of the cooperative machine makes very good control and the most powerful production. Splash plating uses the high voltage electric field as the plasma coating material, and uses almost all high melting point metals, alloys and metal oxides, such as chromium, molybdenum, tungsten, titanium, silver, gold, etc. Moreover, it is a process of forced accumulation, The adhesion between the electroplating layer and the plastic substrate obtained by using this technology is far higher than that of the vacuum evaporation method. However, the processing cost is relatively high. Vacuum sputtering of vacuum coating machine is a technology to obtain the film through ion collision, which is mainly divided into two types, namely, cathode sputtering and RF sputtering. Cathodic sputtering is generally used for sputtering conductors, and radio frequency sputtering is generally used for sputtering non-conductors. The environment required for cathodic sputtering is: a, high vacuum to reduce the occurrence of oxides; b, lazy skill gas, generally argon gas c, electric field d, magnetic field e, and cooling water to take away the high heat generated during sputtering.