pvd coating machine magnetron sputtering includes many types. Each has different working principles and application objects. However, there is one thing in common: the interaction between the magnetic field and the electron makes the electron run in a spiral near the target surface, thus increasing the probability of the electron hitting the argon gas to produce ions. The resulting ions hit the target surface under the action of electric field and sputtered out the target material. In the development of recent decades, we gradually use permanent magnets, and rarely use coil magnets.

The target source is divided into balanced and non-balanced, the balanced target source coating is uniform, and the non-balanced target source coating film and matrix bonding force is strong. Balanced target source is mostly used for semiconductor optical film, non-balanced target source is mostly used for wear decorative film.
Regardless of the balance is not balanced, if the magnet is stationary, its magnetic field characteristics determine that the general target utilization rate is less than 30%. In order to increase the utilization rate of the target material, a rotating magnetic field can be used. However, rotating the magnetic field requires a rotating mechanism, and the sputtering rate should be reduced. Rotating magnetic fields are mostly used for large or valuable targets. Such as semiconductor film sputtering. For small equipment and general industrial equipment, the magnetic field stationary target source is used.
It is easy to sputter metals and alloys with a magnetron target source, and ignition and sputtering are convenient. This is because the target (cathode), plasma, and vacuum chamber of the splashed part can form a loop. But if the sputtered insulator is like ceramic, the circuit is broken. So people use high-frequency power supplies, and strong capacitors are added to the circuit. This makes the target a capacitor in the insulated loop. However, the high frequency magnetron sputtering power supply is expensive, the sputtering rate is very small, and the grounding technology is very complex, so it is difficult to adopt on a large scale. To solve this problem, magnetron reactive sputtering was invented. It's a metal target with argon and a reaction gas like nitrogen or oxygen. When the metal target hits the part, due to energy conversion, it combines with the reaction gas to form nitride or oxide.
Magnetron reactive sputtering insulators seem easy, but the actual operation is difficult. The main problem is that the reaction occurs not only on the surface of the part, but also on the anode, the vacuum chamber surface, and the target source surface. Thus causing fire suppression, target source and workpiece surface arc. The twin target source technology invented by Leybold Germany solves this problem well. The principle is that a pair of target sources are anode and cathode each other, thereby eliminating oxidation or nitriding on the anode surface.
Cooling is necessary for all sources (magnetics, multi-arcs, ions), because a large part of the energy is converted to heat, and if there is no cooling or insufficient cooling, this heat will make the temperature of the target source reach more than one thousand degrees, thus melting the entire target source.
A magnetic control device is often very expensive, but people tend to spend money on other equipment such as vacuum pumps, MFC, film thickness measurement and ignore the target source. No matter how good the magnetron sputtering equipment without a good target source, it is like drawing a dragon without a finishing touch.
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