In the vacuum of the chamber of the magnetron sputtering vacuum coating machine, high-energy particles bombard the surface of the material, so that the atoms gain enough energy to escape from the surface and reach the substrate to condense into a film. Compared with real hair coating, sputter coating is suitable for all (including high melting point) materials, and has the advantages of strong adhesion, controllable ingredients, and easy large-scale production.

1. Magnetron sputtering vacuum coating machine diode sputtering
      A sputtering coating technology that adds a DC high voltage between the target and the substrate, ionizes the gas between the plates (usually Ar2), and bombards the target surface with high-speed charged ions. To maintain self-sustaining discharge, at a normal sputtering distance of several centimeters between two electrode plates, the discharge voltage is generally as high as 10 Pa, which is detrimental to sputtering efficiency and film quality. Therefore, DC sputtering mostly uses non-self-sustaining discharge, that is, quadrupole sputtering with the addition of a thermal electron emitter and an auxiliary anode, which allows sputtering to be performed at a low pressure of 10-1 to 10-2 Pa.
Advantages: simple structure
Disadvantages: Only metal materials with good conductivity can be sputtered, and the sputtering efficiency is low.

2. Magnetron sputtering vacuum coating machine radio frequency sputtering
      An RF power supply is used instead of a DC power supply, and a high-frequency voltage is applied between the target and the substrate. During sputtering, the target will produce a self-bias effect (that is, the target will automatically be at a negative potential state), so that the sputtering of the insulating target can be maintained. . A commonly used frequency is around 13.56 MHz.

Advantages: All materials can be sputtered, including conductors and insulators, with high sputtering efficiency and mass production
Disadvantages: RF power supplies have certain radiation problems
3. Magnetron sputtering vacuum coating machine magnetron sputtering
The working principle of magnetron sputtering is that electrons collide with argon atoms while flying towards the substrate under the action of the electric field E, causing them to be ionized to produce Ar positive ions and new electrons; the new electrons fly towards the substrate, Ar ions accelerate towards the cathode target under the action of the electric field and bombard the target surface with high energy, causing the target material to sputter. In sputtering particles, neutral target atoms or molecules are deposited on the substrate to form a thin film, and the secondary electrons generated will be affected by the electric field and magnetic field, resulting in a drift in the direction pointed by E (electric field) × B (magnetic field), referred to as E×B drift, its motion trajectory is approximate to a cycloid. If it is a toroidal magnetic field, the electrons will move in a circular motion on the target surface in an approximate cycloid form. Not only will their movement path be very long, but they will also be trapped in the plasma region close to the target surface, and a large amount of ions will be ionized in this region. Ar is used to bombard the target, thereby achieving high deposition rates. As the number of collisions increases, the energy of the secondary electrons is exhausted, gradually moves away from the target surface, and is finally deposited on the substrate under the action of the electric field E. Since the energy of the electron is very low, the energy transferred to the substrate is very small, resulting in a low temperature rise of the substrate. Magnetron sputtering is a collision process between incident particles and target. The incident particles undergo a complex scattering process in the target, collide with the target atoms, and transfer part of the momentum to the target atoms, which in turn collide with other target atoms, forming a cascade process. In this cascade process, some target atoms near the surface gain sufficient momentum to move outward, leaving the target and being sputtered out.
Advantages: high film formation rate, low substrate temperature, good film adhesion, and large-area coating can be achieved
Disadvantages: Target consumption is uneven, and targets made of magnetic materials cannot be used.
4. Magnetron sputtering vacuum coating machine reactive sputtering
The development of modern surface engineering increasingly requires the use of various compound films. Reactive magnetron sputtering technology is one of the main ways to deposit compound films. To deposit a compound film with multiple components, you can use a target made of compound materials for sputtering deposition. You can also pass a certain reaction gas, such as oxygen or nitrogen, into the sputtering pure metal or alloy target to reactively deposit the compound film. This is called reactive sputtering. It is usually easier to obtain high purity of pure metal targets and reactive gases, so reactive sputtering is widely used to deposit compound films.
advantage:
(1) Reaction The target material (single element target or multi-element target) and reaction gas (oxygen, nitrogen, hydrocarbons, etc.) used in magnetron sputtering are of high purity, which is beneficial to the preparation of high-purity compound films.
(2) By adjusting the process parameters in reactive magnetron sputtering, chemically proportioned or non-chemically proportioned compound films can be prepared, and the film properties can be controlled by adjusting the composition of the film.
(3) The substrate temperature rises less during the reactive magnetron sputtering deposition process, and the substrate is usually not required to be heated to high temperatures during the film production process, so there are fewer restrictions on the substrate material.
(4) Reactive magnetron sputtering is suitable for preparing large-area uniform thin films, and can achieve industrialized production of coatings with a single machine annual output of millions of square meters.
Disadvantages: Problems such as target poisoning and anode disappearance are prone to occur