Magnetron sputtering technology can be used to prepare decorative films, hard films, corrosion-resistant friction films, superconducting films, magnetic films, optical films, as well as various films with special functions. It is a very effective film deposition method and is widely used in various industrial fields.

"Sputtering" refers to that particles with certain energy (generally Ar + ions) bombard the solid (target) surface, so that the solid (target) molecules or atoms leave the solid, eject from the surface and deposit on the workpiece to be plated. Magnetron sputtering is to establish a magnetic field orthogonal to the electric field on the surface of the target. The electron is accelerated by the electric field and bound by the magnetic field. The trajectory of the electron is cycloid, which increases the probability of collision between the electron and charged particles and gas molecules, improves the ionization rate of the gas and the deposition rate.

Magnetron sputtering technology has higher particle energy and better film substrate bonding force than evaporation technology. "Magnetron sputtering ion coating technology" is based on the common magnetron sputtering technology, adding bias voltage on the surface of the workpiece, and metal ions are deposited on the surface of the workpiece under the force of bias electric field. The film quality and film substrate bonding force are far better than the ordinary magnetron sputtering coating technology.

According to the shape of the target, the magnetron sputtering target can be divided into round magnetron sputtering target, planar magnetron sputtering target and cylindrical magnetron sputtering target. Circular targets are mainly used in scientific research and a small number of industrial applications. Planar targets and cylindrical targets are widely used in industry, especially cylindrical targets, which are more and more used with ultra-high target utilization rate and stable working state.

Magnetron sputtering is an ideal target source for metal evaporation: stable discharge, easy control of deposition rate and uniform coating. However, in the process of chemical reactive coating (tin, TiO2), the reactive gas will cause poisoning (chemical reaction) on the magnetron target surface, and the evaporation rate will decrease sharply In order to solve this problem, Beijing Danpu Surface Technology Co., Ltd. has developed a rectangular gas ion source.

Advantages of gas ion source:

● No filament, no hollow cathode, no hot cathode, no grid, no metal sputtering pollution on the gas ion source; suitable for any inert and reactive gases and their mixtures;

● It has simple structure, good insulation, long service life and few maintenance requirements;

● Rectangular structure, fully matching with the size of rectangular magnetron sputtering source, and evenly distributing air to the coating area of vacuum chamber;

● In the vacuum range of magnetron sputtering, the ion source can work normally and stably, and the air intake of the ion source meets the working conditions of the magnetron sputtering source;

● The end flange structure is sealed for easy installation. Adjust the air distribution direction at 360 degrees.

Application of gas ion source technology:

1. GIMS tin (thick tin film above 1 μ m) is then plated with Au (alloy) or rose gold (high grade IPG). Single furnace is completed at one time;

2. Gims-ss + tin (thick film), and then Au (alloy) or rose gold plating (single furnace completed at one time). Then, the tin layer and gold layer in the outer layer are removed by partial mask to realize the dual color effect of white and gold;

3. Through Ar gas GIS discharge, Ar ion bombardment cleaning function plasma treatment (cleaning) was realized, which replaced the ultrasonic cleaning function of water quality of electroplating parts in sanitary ware. The technical requirements of green environmental protection are realized;

4. The surface of semiconductor integrated circuit was cleaned by GIS Ar ion bombardment to enhance the adhesion of metallized film on the surface of plastic package.

Ion assisted evaporation coating technology is based on the traditional evaporation coating, using the principle of ion plating to improve the ionization rate of evaporation coating, and then improve the performance of evaporation coating layer.

Ion assisted evaporation technology aluminum plating technology is widely used in various military and civil anti-corrosion functional coatings, used to replace electroplating, such as: neodymium iron boron surface aluminizing corrosion protection, aviation fastener aluminum coating corrosion protection and so on.

Hipims is a high power impulse magnetron Sputtering is a kind of magnetron sputtering technology which uses high peak pulse power and low pulse duty cycle to produce high metal ionization rate. The peak power of hipims can reach MW level, but its average power is the same as that of conventional magnetron sputtering due to short pulse duration, so that the cathode will not increase the cooling of target due to overheating. Hipims combines the advantages of low temperature deposition by magnetron sputtering, smooth surface, no particle defects, high metal ionization rate, strong film adhesion and compact coating. The ion beam does not contain large particles. It can obtain excellent film substrate bonding force while controlling the microstructure of the coating. It has idle advantages in reducing the internal stress of the coating and improving the density and uniformity of the coating, It is considered to be an important technological breakthrough in the development history of PVD in recent 30 years, especially in the application of hard coating and functional coating.

PVD is the abbreviation of physical vapor deposition (PVD). It refers to the technology of vaporizing material (commonly known as target or film material) into gaseous molecules, atoms or ions under vacuum conditions, and depositing them on the workpiece to form films with certain special functions. The common PVD deposition technologies include evaporation technology, sputtering technology and arc technology.

Ion plating technology is a kind of PVD technology, which means that in the process of PVD deposition, the metal or non-metallic plasma (such as Ti ion, N ion) is formed by the plated material, and the plasma is deposited on the workpiece surface under the action of bias voltage electric field. In the process of ion plating, the ion energy is stronger, the ion diffraction is better, the adhesion force of the film is better, the density of the film is better, and the performance of the film is better.

Ion plating technology is widely used, including decorative coating, hard coating of tools and moulds and various functional coatings.

HCVAC fourth generation cathode arc technology is abbreviated as follows:

① Driven by the composite magnetic field of permanent magnet and pulsed electromagnetic field, the arc spot moves faster and the arc spot is more finely broken, which effectively suppresses the "micro droplet";

② By changing the voltage and frequency of the pulsed electromagnetic field, the movement of the arc spot can be controlled to make the target ablation more uniform and the target utilization rate is high;

③ The composite magnetic field can push the plasma to the workpiece, enhance the plasma density near the workpiece and change the deposition reaction environment;

④ The microstructure of the coating can be effectively controlled and the comprehensive properties of the coating can be greatly improved.

Etching technology is the abbreviation of gas ion etching and auxiliary deposition technology

① Before coating, argon and hydrogen were ionized by GIS gas ion source, and the produced gas ions (Ar + and H +) were etched and cleaned under bias voltage;

② In the coating, argon, nitrogen, oxygen and other reactive gases were ionized by GIS gas ion source, and then sputtered or arc deposited;

The advantages of etching technology are as follows:

① The gas plasma has a wide energy range, which can be strong or weak, and is suitable for various types of workpieces;

② The surface oxide layer can be removed effectively, the etching cleaning effect is more thorough, and the adhesion of membrane to substrate is good;

③ Auxiliary deposition is beneficial to the compactness and uniformity of the coating;

Gas sputtering technology gas ion source enhanced magnetron sputtering technology can be divided into two types: convergent gas ionization sputtering and space separation gas ionization sputtering.

The function of ion source is as follows

1. Plasma cleaning

2. Ionization reaction gas

3. Auxiliary deposition

4. Inhibition of target poisoning

5. Post ion oxidation treatment

Converging gas ionization sputtering technology:

The gas ion source ionizes and distributes the reactive gas. Under the action of the electric field of the ion source, a large number of gas ions gain kinetic energy (temperature) and fly to the surface of the workpiece to produce bombardment, which effectively enhances the reactive ion coating effect of magnetron sputtering. In the process of reactive coating, gas ions bombard the surface of the workpiece, the unstable ions on the surface are blasted off, and the film structure is "tamped", which makes the film more compact and smooth.

The technology has been applied to DLC coating and achieved very good results.

Air separation and sputtering technology

On the same sputtering system, the gas distribution direction of gas ion source is turned away from the coating area of magnetron sputtering target. The separation of magnetron sputtering metal coating process and ionization bombardment reaction process of gas ion source in "space" was realized. When a workpiece is coated with a metallic film on the target by magnetron sputtering, and then moves to the front of the gas ion source, the reaction process of gas ion bombardment reaction (such as nitriding) is carried out, which is the so-called air separation (separation) sputtering reactive ion plating.

It has a very good effect on controlling the poisoning of sputtering target, which makes the reactive sputtering ion plating more controllable and the coating window wider.

MPCVD (microwave plasma technology) is considered to be the most ideal method for preparing synthetic diamond in the future because it can produce large area and high-quality diamond.

Main features: high electron density in plasma, high concentration of atomic H generated, no electrode pollution, stable plasma can be generated under high pressure, and the quality of diamond film grown is high.

Microwave method can prepare large area and high-quality diamonds, which is the most ideal method for preparing synthetic diamonds in the future. Microwave CVD method can prepare high-quality diamonds, which can be used as ornaments such as diamonds after processing, and its price is only about a quarter of that of natural diamonds. Single crystal diamond with high purity can not only be made into jewelry, but also be used as a core material in semiconductor, 5G communication, high-end equipment, military industry and other scientific and technological fields due to its outstanding characteristics in electricity, optics, mechanics and heat.