As the complexity and integration of semiconductor design increase with the development of technology, new packaging solutions have become a driving factor. Recently, smart phones are increasingly installed in devices to improve their functionality in wireless systems. On the other hand, the clock frequency and data transmission speed of embedded circuit increase, which makes it easy to generate electromagnetic noise used in wireless system. Traditionally, the board level "can shield" method is used to block noise, which makes it difficult to be miniaturized and thinned. In order to solve this problem, a new technology of shielding semiconductor package itself has appeared.

Package level electromagnetic shielding makes PCB smaller and thinner. In addition, the packaged semiconductor components have the advantage that they can be placed anywhere on the system board. The magnetron sputtering continuous coating production line with high quality electromagnetic shielding film has been developed in HCVAC.

◎ Step coverage
By adjusting the tray rotation angle and sputtering angle, the coating line can form a shielding with 50% or higher step coverage.
By depositing the shielding layer with high step coverage, the target efficiency can be maximized, and the production time can be greatly increased by shortening the deposition process time.
◎ Automatic system
The coating production line is optimized for the production process through an automatic system. The system is easy to disassemble and overcomes the limitations of conventional tape processing.
◎ High throughput
As long as the coating line does not affect the step coverage, it can maximize production by minimizing the gap between semiconductor packages.
In addition, the beat time is shortened to the greatest extent, thus the unit output per hour (UPH) is increased by more than twice, which is twice that of traditional sputtering equipment.
◎ Adhesion
The coating production line adopts plasma treatment to improve the adhesion between semiconductor packaging materials and shielding layer. Physically speaking, the surface area is increased by improving the surface roughness of semiconductor packaging.
In addition, chemically, the surface energy increases due to the increase of activated oxygen atoms, the decrease of ion concentration and the decrease of carbon element.
The change of surface energy can be measured by contact angle.